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The 7th China semiconductor sealing measurement technology and market conference held in wuxi
2010-11-4          Source：
 
June 2009, 9-12, by China semiconductor industry association, China semiconductor industry association encapsulation branch units undertaking the 7th China semiconductor sealing measurement technology and market conference held in wuxi, meeting the encapsulation testing market development trend, advanced technology and encapsulation testing green encapsulation industry hotspot problem aerobics. ChangDian technology were invited to send more than 20 representatives attended the seminar. The chairman, WangXinChao as distinguished guests attended the current situation of China semiconductor packaging test industry faces challenges and opportunities "theme BBS, and expert copolymerization tin city, this paper discusses among domestic semiconductor packaging industry development in future. ChangDian technology technical director LiangZhiZhong with "SiP system-level technology in current research topic of encapsulation ?

 
 
 
 
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